Solved Advice on consitency of new system

Hello there,

I'm planning to build a new system in near future and need to be sure of the consistency of the new components I've choosen before I order them. Maybe there are some hardware savvy guys amongst you who are able to detect frictions in terms of the interplay of the components. The system will be mostly used for Home Theater and rare gaming.

The new system shall be as follows:

Mainboard: MSI H87M-P32 mATX LGA1150
CPU: i5 4670 - 3.4 Ghz TRAY (I'll be using the 4600 graphics unit)
RAM: GSkill NQ Series F3 12800CL9D-4GBNQ Dual Channel DDR3
CPU Cooler: Scythe Mugen 4
Thermal paste: Coollaboratory Liquid Pro
Case: Cooltek K2 3.0 Midi Tower ATX

Some 'old' components of my recent system will be taken over:

PSU: Cooler Master Silent Pro MII 420 W
SSD: Samsung 840 Pro 128 GB
Case Cooling: Scythe Gentle Typhoon 12cm 800 rpm

My focus is on a very quiet (not completely silent) system in idle mode resp. under low load or while watching video with available (cooling-) recources when needed. It's idle power consumption should be as little as possible.
I'm wondering about the measures of the case (19cm) and the height of the tower cooler (15,6cm), for example. I want everything to fit in without pain. The RAM hasn't high heat spreaders.

Is there anything I should consider?

Thanx for reading and commenting.

Hybrid

Hello Hybrid,

Your Motherboard, CPU, and RAM look like a good configuration to run at 1600MHz.
You transfered PSU seems adequate to run your new rig without a dedicated graphics arrangement.
The SSD is certainly OK.

However, I can't comment on the case or how components might fit.

Good luck.

I checked the the Cooltek website for the cases spec and they show the maximum height for CPU coolers as 160mm, the cooler you have chosen is 160mm height, it will be a tight fit but should fit nonetheless. You may have to remove the back case fan if you find the side of the heatsink is rubbing against it. I would recommend getting a Coolermaster Hyper 212 Evo as the width of the cooler is smaller and it has made over 7000 users happy with it's performance and cooling (Newegg). As for the thermal paste, I recommend going with Arctic Silver 5 as I heard the thermal paste you have chosen is rather difficult to apply and if the heatsink has any aluminum on the base, it will not be very effective. AS5 is easier to apply, safe to use with the Hyper 212 Evo and the temps will still be good as your system will mainly be for HTPC purposes. As for the Mobo, CPU, RAM, PSU, and SSD, I agree with my2cents.

AS5 link with reviews: Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound AS5-3.5G - OEM - Newegg.com

Coolermaster Hyper 212 Evo with reviews: COOLER MASTER Hyper 212 EVO RR-212E-20PK-R2 Continuous Direct Contact 120mm Sleeve CPU Cooler Compatible with latest Intel 2011/1366/1155 and AMD FM1/FM2/AM3+ - Newegg.com

Both have over 6k reviews and are 5 stars making them excellent to use . Hope I helped!

Thanks for your answers.
Since my given sys specs are just a rough blueprint, I'm always open for new input.

I also looked at the Nanoxia Deep Silence 1 case which width is 220mm. That should fit any modern cooler.
I've heard about the difficulties applying the thermal compoud I've choosen. But it seems to be the most effectifve stuff around. It should come towards the approach of semi-passive cooling. The coolers base is made of copper and nickel.
But I'll consider your suggestions. Thanx again.

no problem, hope everything goes smoothly!

IC Diamond 7 Carat, CPU Thermal Paste-Grease-Compound

Home with Test-Results etc.

PS: I use it myself and I'm quite happy with it.

Thermaltake FRIO Extreme

Thermaltake FRIO OCK

PS: I had the FRIO OCK and it was a good Cooler and I was able to run a 2600k @5012MHz.

Hi there,
I put my system together last week and up to now everything went smooth. I decided to change the case to be a Cooler Master Silencio 650 pure and the CPU cooler to be Thermalright Macho. As for the thermal compound I used Gelid Extreme, which was tested to be on 2nd place after the liquid metal products, 1st place of the non-condicting pastes. I put one lentil sized blop in the middle of the CPU and didn't spread it to make sure no air cells were implemented. So the contact pressure of the heat sink did the job of spreading. The system is very quiet and even in fan-silent mode temperatures don't exceed 47 C° under heavy load while converting video. Idle temps are barely above room temperature. I just put in my SSD with Windows 8.1 installation and it worked. I had to threw out some old drivers and install the new ones. I'm waiting for MS to release an 8.1 ISO which works with my retail key and will perform a clean install.