RAMMon v1.0 Build: 1008 built with SysInfo v1.0 Build: 1030
PassMark (R) Software - www.passmark.com

Memory Summary For DESKTOP
Number of Memory Devices: 2	Total Physical Memory: 8159 MB (8192 MB)
				Total Available Physical Memory: 5611 MB
				Memory Load: 31%	

ItemSlot #1Slot #2Slot #3Slot #4
Ram Type Not Populated DDR3 Not Populated DDR3
Maximum Clock Speed (MHz) 1066.67 (XMP) 1066.67 (XMP)
Maximum Transfer Speed (MHz) DDR3-2133 DDR3-2133
Maximum Bandwidth (MB/s) PC3-17066 PC3-17066
Memory Capacity (MB) 4096 4096
Jedec Manufacture Name G Skill Intl G Skill Intl
Search Amazon.com Search! Search!
SPD Revision 1.0 1.0
Registered No No
ECC No No
DIMM Slot # 2 4
Manufactured Year 0 Year 0
Module Part # F3-17000CL9-4GBXLD F3-17000CL9-4GBXLD
Module Revision 0x0 0x0
Module Serial # 0x0 0x0
Module Manufacturing Location 1 1
# of Row Addressing Bits 15 15
# of Column Addressing Bits 10 10
# of Banks 8 8
# of Ranks 2 2
Device Width in Bits 8 8
Bus Width in Bits 64 64
Module Voltage 1.5V 1.5V
CAS Latencies Supported 7 8 9 7 8 9
Timings @ Max Frequency (JEDEC) 9-9-9-28 9-9-9-28
Maximum frequency (MHz) 800.00 800.00
Maximum Transfer Speed (MHz) DDR3-1600 DDR3-1600
Maximum Bandwidth (MB/s) PC3-12800 PC3-12800
Minimum Clock Cycle Time, tCK (ns) 1.250 1.250
Minimum CAS Latency Time, tAA (ns) 11.250 11.250
Minimum RAS to CAS Delay, tRCD (ns) 11.250 11.250
Minimum Row Precharge Time, tRP (ns) 11.250 11.250
Minimum Active to Precharge Time, tRAS (ns) 35.000 35.000
Minimum Row Active to Row Active Delay, tRRD (ns) 6.000 6.000
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 46.250 46.250
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) 160.000 160.000
DDR3 Specific SPD Attributes
Write Recovery Time, tWR (ns) 15.000 15.000
Internal Write to Read Command Delay, tWTR (ns) 7.500 7.500
Internal Read to Precharge Command Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000 30.000
RZQ / 6 Supported Yes Yes
RZQ / 7 Supported Yes Yes
DLL-Off Mode Supported Yes Yes
Maximum Operating Temperature (C) 95 95
Refresh Rate at Extended Operating Temperature Range 1X 1X
Auto-self Refresh Supported Yes Yes
On-die Thermal Sensor Readout Supported No No
Partial Array Self Refresh Supported No No
Thermal Sensor Present No No
Non-standard SDRAM Type Standard Monolithic Standard Monolithic
Module Type UDIMM UDIMM
Module Height (mm) 30 30
Module Thickness (front), (mm) 2 2
Module Thickness (back), (mm) 2 2
Module Width (mm) 133.5 133.5
Reference Raw Card Used Raw Card B Rev. 0 Raw Card B Rev. 0
DRAM Manufacture ID 1229 1229
# of DRAM Rows 0 0
# of Registers 0 0
Register Manufacturer
Register Type
Register Revision 0 0
XMP Attributes
XMP Revision 1.2 1.2
Enthusiast / Certified Profile
Module voltage 1.65V 1.65V
Clock speed (MHz) 1066.67 1066.67
Transfer Speed (MHz) DDR3-2133 DDR3-2133
Bandwidth (MB/s) PC3-17066 PC3-17066
Minimum clock cycle time, tCK (ns) 0.938 0.938
Supported CAS latencies 9 9
Minimum CAS latency time, tAA (ns) 8.125 8.125
Minimum RAS to CAS delay time, tRCD (ns) 10.313 10.313
Minimum row precharge time, tRP (ns) 7.813 7.813
Minimum active to precharge time, tRAS (ns) 25.417 25.417
Supported timing at highest clock speed 9-11-9-28 9-11-9-28
Minimum Row Active to Row Active Delay, tRRD (ns) 6.042 6.042
Minimum Active to Auto-Refresh Delay, tRC (ns) 43.125 43.125
Minimum Recovery Delay, tRFC (ns) 159.375 159.375
Minimum Write Recovery time, tWR (ns) 15.000 15.000
Minimum Write to Read CMD Delay, tWTR (ns) 7.500 7.500
Minimum Read to Pre-charge CMD Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000 30.000
Maximum Average Periodic Refresh Interval, tREFI (us) 7.813 7.813
Write to Read CMD Turn-around Time Optimizations No adjustment No adjustment
Read to Write CMD Turn-around Time Optimizations No adjustment No adjustment
Back 2 Back CMD Turn-around Time Optimizations No adjustment No adjustment
System CMD Rate Mode 1T 1T